UG mold design part of the (full three-dimensional design)
1. UG installation and customization.
2. Layers of knowledge and color management.
3. Curve and editing.
4. Sketch design.
5. Solid modeling and editing, direct modeling, complex modeling.
6. Create complex surface and surface editing.
7. Top-down assembly design and management of reference set.
8. Parametric design of the assembly and editing (WAVE LINK, clone assembly, expression management, etc.).
9. Full 3-D inspection (interference and clearance CHECK CHECK etc. Draft analysis and upside down faces (UNDERCUT) of the minimum angle of R, etc.).
10. Inside and outside the slider design.
11. Drafting 2-dimensional graph drawing and die assembly, explosive open map.
12. Reverse Engineering (point cloud to surface, etc.).
13. CAD2-dimensional design.
14. Print out the map.
15. Mold design (three plate cold runner mold, the two plate cold runner mold, hot runner molds and semi-cold semi-hot runner (SEIMI-HOT) die; hot runner plate design, hot runner nozzle design, etc.).
16. IGS, STEP, PARASOLID broken surface repair, broken body repair and so on.
17. Product analysis and review (for example: the design of the customer's products help mold the proposed changes, etc.). 18. Core (CORE) and cavity (CAVITY) design (commonly used parting ways, etc.).
19. Mold design.
20. MOLDWIZAR mold design (sub-mode, cooling, thimble, GATE, transfer standard parts and standard mold, etc.).
21. Electrode design (discounted Copper Company).
22. How to solve the sub-module separated from methods (hand-construct the parting surface method, playing solid patch method, etc.) 23. Explain the 2D structure mold assembly diagram.
24. UG, CAD mold design and processing technology of basic theoretical knowledge.
25. UG ranking and two-dimensional CAD three-dimensional mold qualifying.
26. Die qualifying process and methods.
27. Die structural analysis and case explaining.
1. UG installation and customization.
2. Layers of knowledge and color management.
3. Curve and editing.
4. Sketch design.
5. Solid modeling and editing, direct modeling, complex modeling.
6. Create complex surface and surface editing.
7. Top-down assembly design and management of reference set.
8. Parametric design of the assembly and editing (WAVE LINK, clone assembly, expression management, etc.).
9. Full 3-D inspection (interference and clearance CHECK CHECK etc. Draft analysis and upside down faces (UNDERCUT) of the minimum angle of R, etc.).
10. Inside and outside the slider design.
11. Drafting 2-dimensional graph drawing and die assembly, explosive open map.
12. Reverse Engineering (point cloud to surface, etc.).
13. CAD2-dimensional design.
14. Print out the map.
15. Mold design (three plate cold runner mold, the two plate cold runner mold, hot runner molds and semi-cold semi-hot runner (SEIMI-HOT) die; hot runner plate design, hot runner nozzle design, etc.).
16. IGS, STEP, PARASOLID broken surface repair, broken body repair and so on.
17. Product analysis and review (for example: the design of the customer's products help mold the proposed changes, etc.). 18. Core (CORE) and cavity (CAVITY) design (commonly used parting ways, etc.).
19. Mold design.
20. MOLDWIZAR mold design (sub-mode, cooling, thimble, GATE, transfer standard parts and standard mold, etc.).
21. Electrode design (discounted Copper Company).
22. How to solve the sub-module separated from methods (hand-construct the parting surface method, playing solid patch method, etc.) 23. Explain the 2D structure mold assembly diagram.
24. UG, CAD mold design and processing technology of basic theoretical knowledge.
25. UG ranking and two-dimensional CAD three-dimensional mold qualifying.
26. Die qualifying process and methods.
27. Die structural analysis and case explaining.
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